Hardware Development : Development Engineer RF/Analog (m/f/x)

Your tasks

• Develop mixed-signal RFIC chip packages by performing electromagnetic and thermal simulations alongside designing the layout.
• Collaborate closely with chip and PCB design teams to define and align system-level requirements.
• Drive the development of innovative eWLB and advanced heterogeneous packaging concepts.
• Coordinate with the purchasing department to engage with external suppliers, ensuring alignment on both technical and commercial objectives.
• Plan and execute qualification processes in close cooperation with the quality assurance team.

Your qualifications

• A degree in communications engineering, electrical engineering, microelectronics, physics, or a related discipline.
• Minimum of 3 years of professional experience in RF and analog design.
• Proficiency in electromagnetic simulation tools (e.g., CST, Ansys HFSS).
• Familiarity with package layout tools (e.g., Cadence APD) is advantageous.
• Solid understanding of key areas such as IC design, PCB layout and manufacturing, and thermal management.
• Strong intercultural competence and willingness to travel internationally on occasion.
• High level of initiative, autonomy, and a structured approach to problem-solving.
• Excellent collaboration and coordination skills across multidisciplinary teams.
• Effective time management and the ability to prioritize tasks.
• Proficiency in both written and spoken German and English.

Interested?

We are looking forward to receiving your application! Ideally, you should apply online with the reference number. If you have any questions, please feel free to contact your recruiting contact via LinkedIn or XING.

Equal opportunities are important to us. We are looking forward to receiving your application regardless of gender, nationality, ethnic and social origin, religion, ideology, disability, age as well as sexual orientation and identity.

Reference number: 13250
Recruiting contact: Sonja Kupfer