May 15, 2024 | Comunicato stampa | Test & measurement

Rohde & Schwarz extends its portfolio with a 2U high oscilloscope/digitizer tailored for rack mount and other applications where a low-profile form factor is critical. The new MXO 5C series is the company’s first oscilloscope without an integrated display. It delivers the same performance as the previously introduced MXO 5 series, but with a fourth of the vertical height.

Oct 01, 2024 | Comunicato stampa | Test & measurement

CETEX, the all-new Consumer Electronics Test & Development Forum and Expo, invites test and development engineers to RAI in Amsterdam from October 9 to 10, 2024. There, Rohde & Schwarz will exhibit its advanced test and measurement solutions that address the latest emerging challenges in consumer electronics development. Visitors can connect with the company’s experts and explore the latest technologies that help them enhance EMC compliance, debug digital protocols faster, or improve the energy efficiency of their products.

May 27, 2024 | Comunicato stampa | Test & measurement

Rohde & Schwarz will showcase its latest solutions for power electronics testing at PCIM Europe in Nuremberg from June 11 to 13. This year, the spotlight will be on solutions that address the challenges of testing and debugging the next generation of wide bandgap semiconductors in power electronic converters. The company’s experts will share their first-hand knowledge of applications such as inverter drive design, double pulse testing and EMI debugging, utilizing cutting-edge test instruments from Rohde & Schwarz.

Jan 23, 2025 | Comunicato stampa | Test & measurement

Rohde & Schwarz enhances its oscilloscope offerings with the launch of R&S ScopeStudio, an innovative application that brings the functionality of the MXO series oscilloscopes to a PC, often a more convenient and effective workspace. This advanced solution allows engineers to visualize, analyze, document and share oscilloscope measurements, making development teams more efficient.

Oct 28, 2024 | Comunicato stampa | Wireless communications

Test and measurement technology leader Rohde & Schwarz with decades of expertise is set to showcase at electronica 2024, held in its home city Munich. Visitors will be able to experience the company’s wide range of solutions designed to help them tackle their test and measurement challenges in the development, verification and production of electronic components and devices – from the everyday to the extraordinary.

Jul 17, 2024 | Comunicato stampa | Electronic design

Rohde & Schwarz further strengthens its oscilloscope portfolio by introducing the industry’s first ASIC-based zone triggering. With this new approach, the MXO series can offer the world’s fastest zone trigger update rate of up to 600 000 waveforms per second and less than 1.45 us blind time between trigger events. It is up to 10 000 faster than competitive zone triggering offerings. Thanks to the new ASIC-based zone triggering, MXO oscilloscopes can precisely isolate events where traditional triggering does not provide the needed flexibility.

Jun 11, 2024 | Comunicato stampa | Test & measurement

Rohde & Schwarz has developed the R&S RT-ZISO isolated probing system, further elevating its cutting-edge oscilloscope portfolio. The new R&S RT-ZISO enables extremely accurate measurements of fast switching signals, especially in environments with high common-mode voltages and currents. Also new is the R&S RT-ZPMMCX passive probe with MMCX connector, which complements the isolated probe system perfectly for certain measurement tasks.

Feb 13, 2025 | Comunicato stampa | Test & measurement

Embedded systems form the core of modern electronic devices, spanning power input stages, main control PCBs, motors, motor controls, sensors and user interfaces. Each functional block requires comprehensive testing to ensure optimal performance, reliability, and a fast market release of the final product. With its extensive portfolio of advanced test solutions, Rohde & Schwarz empowers design engineers to tackle the emerging challenges in all embedded systems: From energy efficiency and electromagnetic interference to digital design and connectivity.